- Materials management and component purchasing
- Rigid and Flex assembly
- Complete range of component assembly
- Lead Free Processing
- Conformal Coating
- Test Development
- Functional Testing
Electrical and Electronic products for OEM
End to end electronic product manufacturing services
Materials management and component purchasin :
The material management operation at GECor involves sourcing of components from approved vendors worldwide. Our office in Bengaluru carefully monitors the quality of material purchased from the Far East and gives our customers the advantage of worldwide sourcing for parts and PCB's.
Rigid and Flex assembly :
Both rigid and flexible boards are routinely assembled. Propriety techniques for automatic assembly of flex circuit boards have been developed by our R&D team of engineers which has greatly benefited our clients.
Complete range of component assembly :
Surface mount technology involves screen printing of solder paste and adhesive, highly accurate component placement, and carefully controlled reflow conditions. Our capabilities in these areas are truly exceptional. All our machines have the most advanced Vision Recognition Technology to achieve the level of accuracy required of the most advanced applications. Boards of up to 510 by 508 mm are printed to an accuracy of +/- 25 microns. The full spectrum of components ranging from large area array components (BGA’s, CCGA's, high density ball grid array surface mount connectors...) to 0402 and 0201 chips are routinely processed.
Lead Free Processing :
Currently 75% of production is ROHS compliant and the rest is leaded processing. GECor has also been involved in various investigations in the processes, materials, and reliability of lead free processes through its active R&D projects.
Conformal Coating :
UV-cured and air cured conformal coating are applied with manual, automatic coating equipment with precision and repeatable results.
Our team of test engineers will provide the necessary consultation for selection of best test strategies.
Functional Testing :
All test development is performed in house by our test engineering team.
Cable harness, a lot more than just connections
Gemini Electronics provides complete Turn-Key manufacturing of various Mil-Spec cable assemblies and wire harnesses for its international customers. Manufacturing a diverse line of high quality Mil-Spec cable assemblies and wire harnesses, our products are 100% tested to meet Industry, Government, and Custom specifications.
Gemini Electronics offers complete custom braiding and sleeving solutions along with your Mil-Spec assemblies. By utilizing an unique method of braiding tinned-copper shielding along with various woven materials, Gemini Electronics delivers a compact and secure harness that ultimately eliminates the need for shrink or molded transitions. This not only improves the look, it improves route-ability and reduces weight.
Use our RFQ Form to submit your assembly drawing(s) for immediate quotation.
PCB Manufacturing & Assembly
ruggedized and fully tested pcb manufacturing and assembly services, PCBA and Customized Design, Manufacturing services, Product Prototyping,
Gemini Electronics offers years of experience working with Mil-Spec requirements and the challenges they bring. We manufacture products to meet both industrial and MIL-PP-55110 requirements. We understand the detail that is required at every step of the process from quoting through shipping, meeting every requirement defined by the customer and any specified MIL Standard.
Our Military and aerospace designs demand compliance with ever-increasing compliance for growing functionality and reliability within extreme environments. We utilize advanced design and layout techniques and 100% design-for-test (DFT) coverage with special attention to Thermal management and EMI / RFI.
There are several key design and layout considerations to make military and aerospace PCBs more robust, these include using correct mil-spec components, designing in an extra cushion of current, maintaining the right aspect ratios, separating power and ground planes, keeping signals clean and properly shielded, verifying impedance calculations and performing pre-layout simulations, using proper termination techniques, adding an extra cushion for mechanical holes and dimensions, maintaining stack up considerations during PCB layout, keeping immaculate assembly notes, specifying an exact drill chart, and defining the proper board material.